KEYNOTE
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The ISESC 2024 Advance Program is now available online!
2024/11/1 11:58:29
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Industry Session, Tutorial Submission Deadline Extended to July 30th, 2024
2024/7/16 10:33:18
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Digest Submission Deadline Extended to July 22nd, 2024
2024/7/1 11:02:19
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Call for Papers for ISESC 2024 Released!
2024/7/1 11:03:34
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Harufusa Kondo Senior Technical Advisor
Mitsubishi Electric Corporation TITLE: Advancement of Power chip and module technology
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Abstract Mitsubishi Electric Corp. has a long history and extensive experience in the development of power devices. This presentation will delve into the latest advancements in our power chips, including Si-IGBT and SiC MOSFET. We will specifically touch on the 8th generation IGBT. Additionally, we will discuss power modules designed for rapidly growing applications in sectors such as renewable energy, railways and power, consumer goods, and automotive.
Biography Dr. Kondo received the B.S., M.S., and Ph.D. degrees from Osaka University, JAPAN. |